Tungsten Oxide Thin Films for Electrochromic Applications: Pulse Width-Controlled Deposition by High-Power Impulse Magnetron Sputtering

- Najafi-Ashtiani, Hamed, Bilek, Marcela M., Akhavan, Behnam

Biofunctionalized 3D printed structures for biomedical applications: A critical review of recent advances and future prospects

- Lotz, Oliver, McKenzie, David R., Bilek, Marcela M., Akhavan, Behnam

Enhanced strength of AlCoCrCu0.5FeNi high entropy alloy thin films reinforced by multi-phase hardening and nanotwins

- Zheng, Zhong, Zhao, Hong, Akhavan, Behnam, Sun, Lixian, Liu, Hongwei, Tsoutas, Kostadinos, Liu, Yanping, Bilek, Marcela M., Liu, Zongwen

High entropy alloy thin films on SS304 substrates: Evolution of microstructure and interface modulated by energetic condensation in nanoscale

- Zhao, Hong, Zheng, Zhong, Jiang, Tenghao, Fu, Li, Akhavan, Behnam, Bilek, Marcela M., Liu, Zongwen

Introducing a new heterogeneous nanocomposite thin film with superior mechanical properties and thermal stability

- Zhao, Hong, Zheng, Zhong, Sun, Lixian, Liu, Hongwei, Tsoutas, Kostadinos, Akhavan, Behnam, Liu, Yanping, Bilek, Marcela M., Liu, Zongwen

Phase decomposition of AlCrFeCoNiCu0.5 HEA thin films by vacuum annealing

- Zheng, Zhong, Zhao, Hong, Sun, Lixian, Liu, Yanping, Fu, Li, Bilek, Marcela M., Akhavan, Behnam, Liu, Zongwen

Recombinant perlecan domain V covalently immobilized on silk biomaterials via plasma immersion ion implantation supports the formation of functional endothelium

- Lau, Kieran, Fu, Lu, Zhang, Anyu, Akhavan, Behnam, Whitelock, John, Bilek, Marcela M., Lord, Megan S., Rnjak-Kovacina, Jelena

The Fabrication and Growth Mechanism of AlCrFeCoNiCu0.5 HEA Thin Films By Substrate-Biased Cathodic Arc Deposition

- Zhao, Hong, Zheng, Zhong, Akhavan, Behnam, Tsoutas, Kostadinos, Sun, Lixian, Zhou, Haoruo, Bilek, Marcela M., Liu, Zongwen

Cold plasma treatment of porous scaffolds: design principles

- Redzikultsava, Katazhyna, Baldry, Mark, Zhang, Anyu, Alavi, Seyedeh K. H., Akhavan, Behnam, Bilek, Marcela M.